GraTherX™ DDR5 Thermal Management Solution

DDR5 memory modules deployed in Edge AI, industrial PCs, embedded systems, and other low-airflow, high thermal density environments are prone to heat accumulation, backside heat concentration, and uneven thermal distribution, which can compromise long-term system stability and reliability. GraTherX™ DDR5 SODIMM is a module-level thermal management solution engineered to address these challenges. 

By combining graphene-copper composite thermal materials with a one-piece dual-side thermal pathway architecture, it creates a continuous heat transfer channel across both sides of the memory module. This enables heat to be conducted, distributed, and dissipated more efficiently, reducing localized hotspots and improving overall thermal balance.

Unlike conventional cooling solutions that primarily target individual hotspots, GraTherX™ optimizes thermal distribution across the entire module, minimizing backside heat accumulation and maintaining more uniform operating temperatures during sustained, high-performance workloads.

Proven Thermal Performance

Under fanless natural convection test conditions, GraTherX™ enables DDR5 modules to achieve:

• Up to 23.4°C reduction in maximum module temperature
• Front-to-back temperature difference reduced to within approximately 1°C

Note: Actual performance may vary depending on system platform, module configuration, airflow conditions, and test environment.

Key Benefits

• Reduce DDR5 Thermal Risks: Minimizes front-to-back temperature differences for more balanced thermal distribution and improved system reliability.
• Enhance Long-Term Operational Stability: Minimizes front-to-back temperature differences for more balanced thermal distribution and improved system reliability.
• Fast Integration into Existing Platforms: Ultra-thin design adds only approximately 0.17 mm per side and supports drop-in implementation without motherboard redesign or additional cooling fans.

Applications

• Edge AI
• Industrial PC
• Embedded Systems
• Fanless Computing Platforms
• Compact AI Systems
• Edge Computing Devices