Wide Temp. UDIMM

DDR3 Wide Temp. UDIMM

Wide Temp. UDIMM

DDR3 Wide Temp. UDIMM

  • On-DIMM thermal sensor : No
  • Package: 240-pin socket type dual in-line memory module (DIMM)
  • PCB: height 30.0 mm, lead pitch 1.0 mm (pin), lead-free (RoHS compliant)
  • Power supply VDD: 1.35V (+0.1V ~ -0.067V) / 1.5V(± 0.075V)
  • Eight Internal banks for concurrent operation (Components)
  • Supports auto pre-charge option for each burst access
  • Supports auto-refresh/self-refresh
  • Refresh cycles: 7.8 ㎲ at 0℃≤ TC ≤ +85℃
  • Operating case temperature range: Industrial (-40 °C ≤ TC ≤ +85°C)
  • PCB: 30μ gold finger
  • Conformal Coating / Underfill (optional)
  • Anti-sulfuration (Apacer patented) (optional)

Introduction

Apacer Wide Temp UDIMM (Wide Temperature UDIMM) is especially designed for harsh climate and special environmental conditions. Able to operate in temperatures ranging from -40°C to 85°C, it is applicable for industrial, military, aeronautical and vehicular systems that face extreme environment challenges. In addition to the use of original industrial-grade DRAM IC, Wide Temp UDIMMs also use industrial-grade wide-temperature-range passive parts with 30u” gold plating PCB to improve anti-oxidation and ensure stability of signal transmission. Wide Temperature UDIMMs have also passed industrial verification testing for high/low temperatures and the most stringent 48-hour thermal cycling test, ensuring their ability to operate for long hours in extreme environments.

wide_temp_memory_EN_3.png (425 KB)
   

 

Insists on using industrial-grade chips

Wide-Temperature_Industrial_IC.png (48 KB)

Spec
  • Model
    DDR3 Wide Temp. UDIMM
  • Module Type
    Wide Temperature UDIMM
  • Memory Technology
    DDR3
  • Speed
    1066/1333/1600
  • Density
    1G/2G/4G/8G
  • Voltage
    1.5v/1.35v
  • Pin Count
    240-Pin
  • Width
    64-Bit
  • PCB Height
    1.18
  • Operating Temperature (°C)
    TC=-40℃ to 85℃
  • Value-added Technology
    Wide Temperature / 30μ Gold Finger
  • Recommended Application
    Defense / Factory Automation / Internet of Things / Transportation

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