Apacer’s rugged memory XR-DIMM uses the innovative board-to-board connector design to fit tightly and securely onto the motherboard. In addition, it adopts the highly durable 300-pin connector and mounting holes to effectively prevent memory modules from dislocating or coming away due to vibration or strong impact. This greatly improves the reliability of memory signal transmissions, serving as the strongest support for applications working under severe environments.

Besides effectively improving products’ anti-vibration and anti-shock reliability, Apacer’s XR-DIMM also supports multiple protection technologies and value-added applications, providing high-end industrial application markets with the most comprehensive rugged memory solutions.

The XR-DIMM’s sealed board-to-board connector is designed to cope with the severe environments, avoiding the traditional memory’s gold finger’s problem of possible oxidation when exposed to outdoor contaminating environments. Also, the XR-DIMM’s Underfill technology further strengthens its anti-vibration ability and thermal shock resistance.

Meanwhile, the Apacer XR-DIMM also supports the guaranteed industrial grade wide-temp chips and has a built-in thermal sensor to monitor the memory’s temperature, effectively preventing the memory module from overheating. Additionally, the Conformal Coating and Anti-Sulfuration technology ensure that the products can operate stably not only under humid and dusty environments but also environments where sulfur-containing gases pervade, providing a whole new option in industrial-grade memory.

• Lead-free (RoHS compliant) / Halogen free 
• Operating case temperature range: Industrial (-40 °C ≤ TC ≤ +85°C)
• Conformal Coating / Underfill (optional)
• Anti-sulfuration (Apacer patented) (optional)