DDR5 Wide Temp. ECC SODIMM
DDR5 Wide Temp. ECC SODIMM
- 262-pin, DDR5 ECC small outline dual in-line memory module (DDR5 ECC SO-DIMM)
- Uses original high-quality DDR5 DRAM ICs
- Equipped with power management IC (PMIC) (5V) on DIMM to efficiently control system power load
- On-die ECC error correction mechanism improves reliability
- Support ECC error detection and correction
- VDD = VDDQ = 1.1V
- VPP = 1.8V
- 32 internal banks; 8 groups of 4 banks each
- Operating case temperature range: Industrial (-40 °C ≤ TC ≤ +85°C)
- PCB: Features gold-plated thickness up to 30µ
- Lead-free (RoHS compliant)
- Halogen free
- Conformal Coating / Underfill (optional)
- Anti-sulfuration (Apacer patented) (optional)
Introduction
Apacer Wide Temp ECC SODIMM (Wide Temperature ECC SODIMM) is especially designed for harsh climate and special environmental conditions. Able to operate in temperatures ranging from -40°C to 85°C, it is applicable for industrial, military, aeronautical and vehicular systems that face extreme environment challenges. In addition to the use of original industrial-grade DRAM IC, Wide Temp ECC SODIMMs also use industrial-grade wide-temperature-range passive parts with 30u” gold plating PCB to improve anti-oxidation and ensure stability of signal transmission. Wide Temperature ECC SODIMMs have also passed industrial verification testing for high/low temperatures and the most stringent 48-hour thermal cycling test, ensuring their ability to operate for long hours in extreme environments.
Insists on using industrial-grade chips
The misuse of commercial IC increases the instability and risk for smart devices, decreasing product lifespan and potentially causing malfunctions. Apacer has long insisted on using industrial-grade chips from original manufacturers in its wide-temp solutions. With Industrial wide-temp IC, Apacer’s industrial memory modules can ensure the stability of operating in harsh environments, where temperatures constantly fluctuate.
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ModelDDR5 Wide Temperature ECC SODIMM
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Module TypeWide Temperature ECC SODIMM
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Memory TechnologyDDR5
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Speed4800/5600
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Density16GB/32GB
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Voltage1.1v
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Pin Count262-Pin
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Width72-Bit
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PCB Height1.18"
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Operating Temperature (°C)TC=-40℃ to 85℃
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Value-added TechnologyThermal Sensor / Wide Temperature / 30μ Gold Finger
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Recommended ApplicationDefense / Factory Automation / Internet of Things / Transportation
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Page Mapping
Page mapping is an advanced flash management technology and can be considered the ideal solution for industrial applications to increase random access speed and improve SSD lifespan, reduce block erase frequency, and achieve optimized performance.
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S.M.A.R.T.
S.M.A.R.T. is a self-monitoring system that provides indicators of drive health as well as potential disk problems. It serves as a warning for users from unscheduled downtime by monitoring and displaying critical drive information.
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CorePower
Apacer's CorePower is a hardware-based technology designed to prevent data loss and ensure the stability of data transmission during a power outage by implementing backup power supply that allows sufficient time to move all cached data to NAND flash.
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DEVSLP
Device Sleep is a feature that allows SATA devices to enter a low power mode by designating pin P3 as DEVSLP signal with an aim to reducing power consumption.
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AES 256-bit Encryption
The security standard trusted by the US government and many international security agencies. It’s an efficient and highly secure way of encrypting data to keep it safe from hackers and other bad actors.
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TCG Opal 2.0
TCG Opal handles the encryption/decryption of information within the device without requiring a host, enabling fast encryption/ decryption and minimizing the risk of data leakage without undermining system performance.
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Write Protect
Write Protect can prevent drives from unauthorized data writing via a hardware switch/pin or vendor software command.
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Conformal Coating
Conformal coating improves product reliability when applied on the surface of printed circuit boards. This protective film can safeguard devices from dust ingression and liquid immersion.
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Underfill
Underfill technique is used under the BGA to strengthen solder joints, and reinforce the product’s resistance against vibration and thermal shock
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Wide Temperature
Apacer’s products are designed with wide temperature support to ensure operation reliability in extreme temperatures ranging from -40ºC to 85ºC.
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30µ Gold Finger
With the 30µ gold plating, the connector interface is more reliable and can withstand the potential damages in industrial applications.
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