SV25C-25 CoreSnapshot 2 Cloud Edition
SV25C-25 CoreSnapshot 2 Cloud Edition
- Low-Density Parity-Check (LDPC) Code
- Global Wear Leveling
- Flash bad-block management
- Flash Translation Layer: Page Mapping
- S.M.A.R.T.
- DataDefender™
- Device Sleep
- ATA Secure Erase
- TRIM
- Hyper Cache Technology
- Over-provisioning
- SMART Read Refresh™
Introduction
SV25C-25 CoreSnapshot 2 Cloud Edition is built with a powerful SATA controller that supports on-the-module ECC as well as efficient wear leveling scheme and implemented with LDPC (Low Density Parity Check) ECC engine to extend SSD endurance and increase data reliability. Furthermore, SV25C-25 CoreSnapshot 2 Cloud Edition is equipped with a built-in thermal sensor to monitor the temperature of the SSD via S.M.A.R.T commands to prevent overheating. For highly-intensive applications, End-to-End Data Protection ensures that data integrity can be assured at multiple points in the path to enable reliable delivery of data transfers. Security-wise, Advanced Encryption Standard (AES) ensures data security and provides users with peace of mind knowing their data is safeguarded at all times.
On top of that, SV25C-25 CoreSnapshot 2 Cloud Edition features CoreSnapshot 2 and Double-barreled Solution to optimize the stability of system operation and management. CoreSnapshot 2 ensures that SV25C-25 can function normally and return to normal operation in the event of unexpected system failures to reduce downtime and maximum output, while Double-barreled Solution extends the practical operating lifespan and integrates seamlessly with alternated RDM platforms, makes monitoring of a complex system much easier and more efficient through the Cloud.
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                                                ModelSV25C-25 CoreSnapshot 2
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                                                InterfaceSATA 3.2 (6Gb/s)
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                                                Connector7-pin SATA signal connector
 15-pin SATA power connector
 3-pin CoreSnapshot 2 connector
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                                                Form Factor2.5”
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                                                NAND Flash Type3D TLC
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                                                Capacity60GB~480GB
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                                                External DRAMNo
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                                                Sequential Read Performance (MB/sec)Up to 550
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                                                Sequential Write Performance (MB/sec)Up to 485
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                                                ECC EngineLow-Density Parity-Check (LDPC) Code
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                                                IOPS (4K Random Write)65K
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                                                Standard Operating Temperature (°C )0 ~ + 70
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                                                Extended Operating Temperature(°C )-40 ~ +85
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                                                Storage Temperature(°C )-55 ~ +100
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                                                Thermal SensorYes
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                                                ShockOperation: Acceleration, 50(G)/11(ms)/half sine
 Non-operation: Acceleration,1500(G)/0.5(ms)/half sine (compliant with MIL-STD-883K)
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                                                VibrationOperation:7.69(Grms), 20~2000(Hz)/random
 (compliant with MIL-STD-810G)
 Non-operation:4.02(Grms), 15~2000(Hz)/random
 (compliant with MIL-STD-810G)
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                                                Operating Voltage5.0 V ± 10%
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                                                Power ConsumptionActive mode: 275 mA / Idle mode:45 mA
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                                                Dimension (L x W x H )100.00 x 69.85 x 6.90 (mm)
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                                                MTBF (hours)>3,000,000
