SV25C-25 CoreSnapshot 2 Cloud Edition
SV25C-25 CoreSnapshot 2 Cloud Edition
- Low-Density Parity-Check (LDPC) Code
- Global Wear Leveling
- Flash bad-block management
- Flash Translation Layer: Page Mapping
- S.M.A.R.T.
- DataDefender™
- Device Sleep
- ATA Secure Erase
- TRIM
- Hyper Cache Technology
- Over-provisioning
- SMART Read Refresh™
Introduction
SV25C-25 CoreSnapshot 2 Cloud Edition is built with a powerful SATA controller that supports on-the-module ECC as well as efficient wear leveling scheme and implemented with LDPC (Low Density Parity Check) ECC engine to extend SSD endurance and increase data reliability. Furthermore, SV25C-25 CoreSnapshot 2 Cloud Edition is equipped with a built-in thermal sensor to monitor the temperature of the SSD via S.M.A.R.T commands to prevent overheating. For highly-intensive applications, End-to-End Data Protection ensures that data integrity can be assured at multiple points in the path to enable reliable delivery of data transfers. Security-wise, Advanced Encryption Standard (AES) ensures data security and provides users with peace of mind knowing their data is safeguarded at all times.
On top of that, SV25C-25 CoreSnapshot 2 Cloud Edition features CoreSnapshot 2 and Double-barreled Solution to optimize the stability of system operation and management. CoreSnapshot 2 ensures that SV25C-25 can function normally and return to normal operation in the event of unexpected system failures to reduce downtime and maximum output, while Double-barreled Solution extends the practical operating lifespan and integrates seamlessly with alternated RDM platforms, makes monitoring of a complex system much easier and more efficient through the Cloud.
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                                                製品名SV25C-25 CoreSnapshot 2
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                                                接続インターフェースSATA 3.2 (6Gb/s)
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                                                コネクタ7-pin SATA signal connector
 15-pin SATA power connector
 3-pin CoreSnapshot 2 connector
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                                                形状2.5”
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                                                NANDフラッシュタイプ3D TLC
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                                                容量60GB~480GB
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                                                外付けDRAMNo
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                                                シーケンシャルリード(MB/s)Up to 550
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                                                シーケンシャルライト(MB/s)Up to 485
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                                                ECC訂正能力Low-Density Parity-Check (LDPC) Code
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                                                IOPS (4Kランダム書き込み)65K
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                                                標準動作温度(°C )0 ~ + 70
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                                                拡張動作温度(°C )-40 ~ +85
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                                                保存温度(°C)-55 ~ +100
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                                                サーマルセンサーYes
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                                                耐衝撃性Operation: Acceleration, 50(G)/11(ms)/half sine
 Non-operation: Acceleration,1500(G)/0.5(ms)/half sine (compliant with MIL-STD-883K)
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                                                耐振動性Operation:7.69(Grms), 20~2000(Hz)/random
 (compliant with MIL-STD-810G)
 Non-operation:4.02(Grms), 15~2000(Hz)/random
 (compliant with MIL-STD-810G)
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                                                動作電圧5.0 V ± 10%
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                                                消費電力Active mode: 275 mA / Idle mode:45 mA
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                                                寸法 (長さ×幅×高さ)100.00 x 69.85 x 6.90 (mm)
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                                                MTBF (時間)>3,000,000
